International Journal of Information Engineering and Electronic Business(IJIEEB)

ISSN: 2074-9023 (Print), ISSN: 2074-9031 (Online)

Published By: MECS Press

IJIEEB Vol.14, No.6, Dec. 2022

Redesign Sanjai Chips Packaging Using Kansei Engineering Method

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Meylia Vivi Putri, Isdaryanto Iskandar, Andhika

Index Terms

Design, Kansei Engineering, Packaging, Sanjai Crackers, Tradisional Minang Food.


Sanjai chips made from cassava is typical tradisional Minang food. Packaging design is fundamental because 89% of consumer responses to buying a product are influenced by packaging. Current packaging weakness are plastic packaging is thin, no accompanying brands, and unattractive packaging, so less attractive, greasy, leaks, and make the chips contained in it be destroyed when bought for souvenirs. For this reason, it is necessary to redesign packaging for sanjai chips to increase product protection and influence consumers. Kansei Engineering is a method that deals with the psychological aspects of consumers when interacting with products to obtain a relationship between feelings and product characteristics. Because of that, this method has been chosen. The kansei process begins with a span of semantic space which begins with determining the kansei word. Kansei words were obtained from the distribution of open questionnaires and also based on previous research. After that, the span of the space of properties is determined which is useful for identifying what product properties should be in the design. after that the synthesis, design and evaluation are carried out. Based on the results from the results of the synthesis of span of semantic space and span of the space of properties, it was found that to design Sanjai Chips packaging, the criteria for packaging design are simple, good, informative, unique, and convincing for packaging materials must be non-greasy, made of plastic, good, strong, and convincing, while for other facilities criteria must be flexible.

Cite This Paper

Meylia Vivi Putri, Isdaryanto Iskandar, Andhika, "Redesign Sanjai Chips Packaging Using Kansei Engineering Method", International Journal of Information Engineering and Electronic Business(IJIEEB), Vol.14, No.6, pp. 37-45, 2022. DOI:10.5815/ijieeb.2022.06.04


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