A Two Layers Novel Low-Cost and Optimized Embedded Board Based on TMS320C6713 DSP and Spartan-3 FPGA

Full Text (PDF, 645KB), PP.64-75

Views: 0 Downloads: 0

Author(s)

Bahram Rashidi 1,* Ghader Karimian 2

1. Department of Electrical and Computer Engineering, Isfahan University of Technology, Isfahan, Iran

2. Department of Electrical and Computer Engineering, University of Tabriz, Tabriz, Iran

* Corresponding author.

DOI: https://doi.org/10.5815/ijmecs.2013.04.08

Received: 24 Dec. 2012 / Revised: 12 Jan. 2013 / Accepted: 20 Feb. 2013 / Published: 8 Apr. 2013

Index Terms

Embedded system design, embedded processors, reconfigurable architectures, Low-Cost, Digital Algorithms, microcomputer ground, data acquisition, real time.

Abstract

This paper presents the design and implementation of a new low-cost and minimum embedded board based on TMS320C6713 (PYP 208-PIN (PQFP)) DSP and Spartan-3 (XCS400-4PQG208C) FPGA in two layers with mount elements on two sides of the board. The proposed embedded board was developed satisfactorily for different applications such as data acquisition of sensor’s with serial port, control units, finite state machines, signal processing algorithms, navigation computing, Kalman filtering etc. Goal of the design was to implement as many as possible low-cost and minimum sizes of the board, also to receive input signals in a short time period and as real time. The board features are include: mount elements in two side of the board for minimization of the proposed board and also placed decoupling capacitors (by pass) for the DSP and FPGA in bottom layer of board strictly below these two ICs because should be placed as close as possible to the power supply pins DSP and FPGA, GND polygon layer is used in total top layer and microcomputer ground for DSP & FPGA in bottom layer, use FPGA for two aim ones for implementation of glue logic total of board and interface between serial connectors, use three RS-232 serial port, one RS-422, and SPI serial port on FPGA, use MT48LC16M16A SDRAM-256MB(4*4MB*16), Am29LV400B Flash memory 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) and XCF02S configuration PROM. The size of the proposed embedded board is 11.1cm*17. 7cm so this board is optimized of aspect cost, performance, power, weight, and size.

Cite This Paper

Bahram Rashidi, Ghader Karimian, "A Two Layers Novel Low-Cost and Optimized Embedded Board Based on TMS320C6713 DSP and Spartan-3 FPGA", International Journal of Modern Education and Computer Science (IJMECS), vol.5, no.4, pp.64-75, 2013. DOI:10.5815/ijmecs.2013.04.08

Reference

[1]Bhavya Daya, “Rapid Prototyping Of Embedded Systems Using Field Programmable Gate Arrays”, Bachelor of Science In Electrical Engineering, Spring 2009.
[2]http://www.trenz-electronic.de/, Trenz Electronic TE0630 Series.
[3]http://www.trenz-electronic.de/, Trenz Electronic GigaBee XC6SLX Series.
[4]http://www.trenz-electronic.de/, Trenz Electronic TE0320 (Spartan-3A DSP) Industrial Micromodule.
[5]www.quickembed.com, guikembed technology Co, TMS320C6713 and EP2C5.
[6]www.ourselec.com, Beijing OURS Electronic TechnologyCo.
[7]http://dlharmon.com/dspcard.
[8]http://www.traquair.com/products/microline.
[9]www.xilinx.com, “Spartan-3A DSP Starter Platform User Guide”, UG454 (v1.1) January 30, 2009.
[10]www.altera.com, “Cyclone II DSP Development Board Reference Manual”, Document Version: 6.0.1, August 2006.
[11]Louis N. Bélanger, “The advantages of using a combination of DSP’s and FPGA’s”, Lyrtech Inc, May, 2004.
[12]“TMS320C6713B Floating Point Digital Signal Processor”, SPRS294B − OCTOBER 2005 − REVISED JUNE 2006.
[13]Intersil, “3.3V, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers”, data sheet, August 2004.
[14]Application Note: XC18V00, and Platform Flash PROMs; Spartan-II, Spartan-3, Virtex, and Virtex-II FPGA Families, “Reading User Data from Configuration PROMs”, XAPP694 (v1.1.1) November 19, 2007.
[15]“Spartan-3 FPGA Family Data Sheet”, DS099 December 4, 2009.
[16]David Bell, Scott Chen, “TMS320C6000: Board Design for JTAG”, SPRA584C - April 2002.
[17]David Bell, “TMS320C6000 Board Design: Considerations for Debug”, SPRA523C - April 2004.
[18]David L. Jones, “PCB Design Tutorial”, June 29th 2004.
[19]Texas Instruments, “PCB Design Guidelines For Reduced EMI”, SZZA009 November 1999.